CMP, or Chemical Mechanical Polishing, is a core process in semiconductor wafer planarization. The retaining ring is a critical component of the polishing head, responsible for holding the wafer, controlling pressure, and guiding the polishing slurry. Due to the extremely harsh working environment, the retaining ring is a highly worn consumable; therefore, the selection of its material is crucial.

PEEK material, with its excellent comprehensive properties, not only perfectly solves the shortcomings of traditional materials in terms of wear resistance, stability, and cleanliness, but also provides a solid guarantee for the long-term stable operation of equipment under extreme conditions through its excellent chemical inertness.

We can provide customized services throughout the entire process, including design, material selection and modification, mold manufacturing, injection molding, and machining, according to the different needs of our customers.